德律TR7700SIII3D介紹：
TRI開創(chuàng)性的3D AOI解決方案，采用超高速混合式PCB檢測法，結(jié)合光學與藍光雷射3D真實輪廓測量，對于自動化檢測不良現(xiàn)象可達到最大化覆蓋率。結(jié)合最先進的軟體解決方案以及第三代智能化硬體平臺，可提供穩(wěn)定且強大的3D 焊點與元件缺陷檢測，具備高檢測覆蓋率與簡易編程優(yōu)點。
德律TR7700SIII3D特性：
1.高速2D+3D檢測，可檢測至01005元件
2.高缺陷覆蓋率，采用混合式2D+3D檢測技術(shù)
3.真實3D輪廓量測技術(shù)，采用雙雷射單位
4.具備自動化資料庫與離線編程功能的智能化快速編程介面
德律TR7700SIII3D規(guī)格：
Optical System
| Imaging Method | Dynamic Imaging with true 3D profile measurement |
| Top Camera | 4 Mpix |
| Angle Camera | N/A |
| Imaging Resolution | 10 μm, 15 μm (factory setting) |
| Lighting | Multi-phase RGB+W LED |
| 3D Technology | Single/Dual 3D laser sensors |
| Max. 3D Range | 20 mm |
Inspection Performance
| Imaging Speed | 4 Mpix@ 10 μm 2D: 60 cm2/sec 4 Mpix@ 15 μm 2D: 120 cm2/sec 4 Mpix@ 10 μm 2D+3D: 27-39 cm2/sec* 4 Mpix@ 15 μm 2D+3D: 40-60 cm2/sec* * Depending on board size and laser resolution |
Motion Table & Control
| X-Axis Control | Ballscrew + AC-servo controller |
| Y-Axis Control | Ballscrew + AC-servo controller |
| Z-Axis Control | N/A |
| X-Y Axis Resolution | 1 μm |
Board Handling
| Max PCB Size | TR7700 SIII 3D: 510 x 460 mm TR7700L SIII 3D: 660 x 460 mm TR7700 SIII 3D DL: 510 x 250 mm x 2 lanes, 510 x 550 mm x 1 lane |
| PCB Thickness | 0.6-5 mm |
| Max PCB Weight | 3 kg |
| Top Clearance | 25 mm |
| Bottom Clearance | 40 mm |
| Edge Clearance | 3 mm [5 mm optional] |
| Conveyor | Inline Height: 880 – 920 mm * SMEMA Compatible |
Inspection Functions
| Component | Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component |
| Solder | Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination |
Dimensions
| WxDxH | TR7700 SIII 3D: 1100 x 1670 x 1550 mm TR7700L SIII 3D: 1300 x 1650 x 1650 mm TR7700 SIII 3D DL: 1100 x 1770 x 1550 mm Note: not including signal tower, signal tower height 520 mm |
| Weight | TR7700 SIII 3D: 1030 kg TR7700L SIII 3D: 1250 kg TR7700 SIII 3D DL: 1150 kg |
